Offering an unparalleled combination of high accuracy, high resolution and speed, MRS® sensors are widely used for inspection and measurement in the SMT and semiconductor markets.
Metrology-Grade Accuracy with MRS® Technology
Fast, Superior Inspection Performance
Versatility for Mid-End and Advanced Packaging Applications
Increase throughput with the MRS® sensor that is 2-3X faster, delivering greater than 25 wafers (300mm) per
hour.
Minimum Feature Diameter
25 µm
FOV
15×15 mm
Lateral Resolution
3 µm
3D Sensor Height Resolution
0.05 µm
3D Repeatability
0.3 µm @ 3σ (VLSI standard)
3D Accuracy
0.2 µm (VLSI standard)
Height Measurement Range
0.25 mm
3D Acquisition Time, typical
150 msec
Illumination
Integrated 2D Illumination