Offering an unparalleled combination of high accuracy, high resolution and speed, MRS sensors are widely used for inspection and measurement in the SMT and semiconductor markets.
Metrology-Grade Accuracy with MRS Technology
Fast, Superior Inspection Performance
Versatility for Mid-End and Advanced Packaging Applications
Increase throughput with the MRS sensor that is 2-3X faster, delivering greater than 25 wafers (300mm) per
hour.
Minimum Feature Diameter (μm)
25
FOV (mm)
15×15
Lateral Resolution (µm)
3
3D Sensor Height Resolution (µm)
0.05
Repeatability (µm) (3σ)
1
Accuracy (µm)
0.2
Height Measurement Range (mm)
0.25
3D Acquisition Time, typical (msec)
150
Illumination
Integrated 2D Illumination