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Fast, 100% Wafer Bump Metrology and Inspection Presentation

As presented during Semicon Taiwan 2020. Mr. Tim Skunes, VP R&D, CyberOptics, discusses the importance of 100% wafer bump metrology and inspection and how the NanoResolution Multi-Reflection Suppression™ (MRS™) Sensor delivers precise 3D inspection and measurement for advanced semiconductor packaging applications.