By: Dr. Subodh Kulkarni, President and CEO, CyberOptics Corporation (as published on Semiconductor Packaging News)
A pandemic and a trade war – calling the past year challenging understates the obvious. The good news – a vaccine is rolling out and a more structured approach to trade policy appears likely. Fortunately, our industry has been not been heavily impacted, and the forecast for 2021 is strong. Consumer demand continues for smaller, more powerful products, driven primarily by developments in 5G, AI, IoT, cloud computing and more.
One clear trend is accelerating growth in the use of advanced packaging processes to deliver smaller, faster, more powerful devices. Controlling these more complex processes requires extensive inspection and metrology, a need that is magnified by the high cost of failure in processes that use expensive, finished die. The need is also amplified by applications with high reliability requirements, like automotive, medical, defense, for which many of the products are destined.
CyberOptics’ NanoResolution Multi-Reflection Suppression™ (MRS™) sensor technology, the heart of our new WX3000™ inspection and metrology system, provides accurate, repeatable 2D and 3D measurements with 100% coverage (no sampling). Ideal for features ranging from 10s to 100s of micrometers in size, the systems inspect at 25 wafers (300mm) per hour, much faster than alternative solutions. It is well-positioned to meet the rapidly growing needs of the of the advanced packaging segment.