WaferSense® Auto Vibration System™ (AVS)

Speed monitoring 3-axis accelerations and vibration to reduce particles, maintenance time and cycle time.

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Speed equipment qualification with wireless measurements.

Collect and display acceleration data wirelessly using the AVS and CyberSpectrum™ software for real-time equipment diagnostics. See the effects of adjustments in real time, speeding equipment alignment and setup.

Shorten equipment maintenance cycles with wafer-like accelerometer.

Observe and optimize wafer, cassette, SMIF and FOUP motions using the AVS three-axis accelerometer. Detect wafer slides, slips, bumps, scrapes and rough handling in real-time with the vacuum compatible AVS, without opening the tool. Optimize motion parameters once the location or absence of water damage is identified.

Lower equipment expenses with objective and reproducible data.

Establish a baseline from known clean tool, then cycle AVS through like a dummy wafer to verify that baseline operation continues. Receive early warning for impending equipment failures and optimize your preventative maintenance plans.

Optimize equipment productivity and yield by maximizing acceleration and minimizing vibration.

Optimized motion profiles and trajectories minimize cycle times and smooth, vibration free handling minimizes particle adders.
Data Sheets

Records vibration data for easy comparison between past
and present, as well as one tool to another, to reduce
particles, maintenance time and cycle time.


Available in 200mm and 300mm wafer sizes.

Highly accurate

Measures acceleration in three directions. x, y and z. with a range of +-2G, resolution of +-0.01G and frequency response 0 to 200 Hz, -3dB.


Transmits data to your laptop of PC in real-time.

Easy-to-use software

CyberSpectrum™: Displays real-time visual feedback. Digital readout allows more precise adjustment. Review functionality integrated; replays log file data for review and analysis.