WaferSense® Auto Vibration System™ (AVS)
Speed monitoring 3-axis accelerations and vibration to reduce particles, maintenance time and cycle time.
Speed equipment qualification with wireless measurements.
Shorten equipment maintenance cycles with wafer-like accelerometer.
Lower equipment expenses with objective and reproducible data.
Optimize equipment productivity and yield by maximizing acceleration and minimizing vibration.
Records vibration data for easy comparison between past
and present, as well as one tool to another, to reduce
particles, maintenance time and cycle time.
Available in 200mm and 300mm wafer sizes.
Measures acceleration in three directions. x, y and z. with a range of +-2G, resolution of +-0.01G and frequency response 0 to 200 Hz, -3dB.
Transmits data to your laptop of PC in real-time.
CyberSpectrum™: Displays real-time visual feedback. Digital readout allows more precise adjustment. Review functionality integrated; replays log file data for review and analysis.