WaferSense® Auto Gapping System™ (AGS)
Improve Uniformity and Yield with WaferSense AGS for Accurate and Repeatable Setups
Achieve the ideal set-up for your equipment by measuring gaps at three points.
Improve tool-to-tool process uniformity with objective and repeatable gap adjustments.
Reduce equipment calibration time through live feedback.
Speed setups, maintenance and troubleshooting with automatic handling.
Speeds non-contact gap measurements and parallelism adjustments under vacuum for semiconductor processes such as thin-film deposition, sputtering and etch. Improves uniformity, tool availability and repeatability.
Available in 200mm and 300mm wafer sizes.
Measures gaps with +-25 micron accuracy within 4 hours of field offset calibration. Gap resolution +-5 microns.
No wires that can break after repeated use and AGS will never be misaligned by strained wires. Transmit data in real-time.
CyberSpectrum software displays numerical and graphical information. Each graphic is color coded to make it easier to see when the gap is above, below or within the user-defined target gap range. CyberSpectrum lets you log time-stamped measurements to a CVS file for documentation and/or analysis.