VIDEO INTERVIEW: Hear Schneider, Daniel’s enthusiasm on location with Global SMT & Packaging at SMT Connect in Nuremberg
Hear Schneider, Daniel‘s enthusiasm on location with Global SMT & Packaging at SMT Connect in Nuremberg. He shares how the MRS and WaferSense technologies bolster Nordson TEST & INSPECTION’s best-in-class portfolio. He also shares his excitement about the upcoming launch of another advanced, differentiated system that is soon to be publicly announced. Kudos to Perkins, Brad and Rand, Christopher, the champions who led the development of this next-generation solution that will delight our customers and increase our competitive advantage in the market.