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Speeding Semiconductor Inspection and Metrology to Increase Yield and Throughput in Fabs
Dr. Subodh Kulkarni, President and CEO, CyberOptics highlights new ways Semiconductor Fabs can improve yields and throughput.
• To speed inspection and metrology of wafer-level and advanced packaging applications, the new 3 micron NanoResolution MRS sensor can complete highly accurate 100% 3D and 2D inspection, 2-3X faster than alternate technologies.
• To speed semiconductor tool set-up, stabilization, and standardization in the Fab front-end, WaferSense wireless measurement sensors can quickly measure and monitor various applications such as leveling and vibration.
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