Video: Q&A; Wafer-Level and Advanced Packaging Inspection and Metrology

Dr. Subodh Kulkarni, President and CEO, CyberOptics sits down for a Q&A to discuss the market dynamics of the wafer-level and advanced packaging market and how the WX3000™ 3D/2D metrology and inspection system provides a unique combination of high resolution, high accuracy and high speed (2-3X faster than alternative solutions) for 100% inspection to improve yields and productivity.