AVLS3
WaferSense® Auto Vibration and Leveling Sensor
Speed simultaneous vibration and leveling measurements.
Speed simultaneous vibration and leveling measurements.
Speed equipment qualification with wireless measurements.
Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.
Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.
With long-range wireless capability, AVLS3 combined with new, easy-to-use CyberSpectrum software, collects and displays both leveling and vibration data simultaneously for fast equipment set-up, alignment and real-time equipment diagnostics.
Wireless, wafer-shaped and battery-powered
Available in 300mm.
Reports inclination in two dimensions
x, and y
Reports Accelerations in three dimensions
x, y and z
Thin
3.5mm, laminated chemically hardened glass substrate.