WaferSense® Auto Vibration and Leveling Sensor
Speed simultaneous vibration and leveling measurements.
Speed equipment qualification with wireless measurements.
Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.
Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.
With long-range wireless capability, AVLS3 combined with new, easy-to-use CyberSpectrum software, collects and displays both leveling and vibration data simultaneously for fast equipment set-up, alignment and real-time equipment diagnostics.
Wireless, wafer-shaped and battery-powered
Available in 300mm.
Reports inclination in two dimensions
x, and y
Reports Accelerations in three dimensions
x, y and z
3.5mm, laminated chemically hardened glass substrate.