WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3)

Speed real-time vibration and leveling measurements.

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Speed equipment qualification with wireless measurements.

Collect and display acceleration, vibration and leveling data. Use the AVLS3 with new CyberSpectrum™ software for real-time equipment diagnostics. See the effects of calibrations in real-time, speeding equipment alignment and set-up.

Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.

Access more chambers with the thin 3.5mm form factor. Enable smooth wafer handling and improved vacuum chucking with the new Chemically Hardened Glass (CHG) substrate. Keep the process areas unexposed to the fab environment with vacuum compatible AVLS3.
New AVLS3H model provides improved usage with three point non-symmetrical edge chucks, seen in furnace and other applications.

Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.

Take the human element out of calibrating equipment with objective measurements for multiple applications in one. Make the right adjustments time after time. Receive early warning for impending equipment failures and optimize your preventative maintenance plans.
Data Sheets

Combination Leveling and Vibration

With long-range wireless capability, AVLS3 combined with new, easy-to-use CyberSpectrum software, collects and displays both leveling and vibration data for fast equipment set-up, alignment and real-time equipment diagnostics.

Wireless, wafer-shaped and battery-powered

Available in 300mm. AVLS3 and AVLS3H versions.

Reports inclination in two dimensions

x, and y

Reports Accelerations in three dimensions

x, y and z


3.5mm, laminated chemically hardened glass substrate.