High Speed

SE500™ Ultra

You can choose the Dual Illumination sensor option for best repeatability and reproducibility results – even on the smallest paste deposits.

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High Speed Inspection

Speed inspection with high speed single illumination sensor and on-the fly measurements at 210cm²/sec.

High Accuracy all-in-one scan

‘All-in-one’ scan technique integrates fiducial, barcode and range scans into one, seamless scan sequence with the SE500ULTRA™ sensor. Dual illumination sensor for improved repeatability is optional.

Fast, Smart, Easy-to-use software

Reduce training efforts and minimize operator interaction saving time and cost with the powerful yet simple software with intuitive multi-touch interface and 3D visualization tools.

Reduce rework costs, increase throughput, improve quality with feedback, and feed forward capable SPI Systems with leading Solder Paste printer and SMT Mounter vendors.

Improve yields and reduce downtime with the CyberPrint Optimizer™ predictive process improvement capability that automatically optimizes the print process by proactively analyzing current trend data.

Improve yields with full-fledged machine-level to factory-level SPC capability.

The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor.

An all-new, improved ultra-fast sensor combined with a unique ‘all-in-one’ scan technique – that integrates fiducial, barcode and range scans into one, seamless scan sequence – makes the SE500ULTRA 30% faster at 210cm²/sec.

Key Features & Benefits

  • All-new, Ultrafast sensor with calibration-free design
  • 30% faster with unique ‘all-in-one’ scan sequence
  • New, Intuitive Touch Screen Interface with World-class Usability
  • Improved Repeatability with Dual Illumination Sensor Option
  • Closed Loop Printer Feedback Ready
  • CyberPrint OPTIMIZER™ Ready
  • Mounter Feed Forward Ready

Ultra 3D SPI Sensor Technology

For improved repeatability on smallest paste deposits, you can choose from the ULTRA and Dual Illumination sensor options on the SE500ULTRA. Pads as small as 100 microns (4 mils) can be accurately measured with the MicroPad sensor. And, it is easy to swap with the standard sensor too – so you can plug-and-play whenever you need to.

Board Size (Max.)

510 x 510 mm

Board Size (Min.)

50 x 50 mm

Inspection Speed @ 30µm

Up to 210cm²/sec

Inspection Speed @ 15µm

80cm²/sec

Gage R&R

<<10%, 6σ