The Ultimate in Speed and Accuracy for Memory Module Inspection

MX3000™ 3D AOI

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The MX3000™ is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS™ Sensors delivering simultaneous dual-sided automated final vision inspection for singulated memory modules – for metrology grade accuracy at production speed.

The system provides in-line defect review stations and auto sorts false calls into good trays after review, is fully automation-ready, SECS/GEM and S2/S8 compliant.

Multi-Reflection Suppression™ (MRS) Technology

MX3000™ offers unmatched accuracy with the revolutionary MRS technology by meticulously identifying and rejecting reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurements making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.

Flexibility At Its Best

The MX3000™ 3D Automated Optical Inspection (AOI) system enables high resolution, dual-sided final vision inspection that doubles productivity. In-line multiple module grippers minimize handing tact time, and autoconversion supports various memory module form factors (RDIMM, SODIMM, VLPDIMM, UDIMM and others.)

Faster, Smarter Programming

With ultra-fast programming capabilities, auto tuning and other enhancements, CyberOptics’ AOI software significantly speeds set-up, simplifies the process, reduces training efforts and minimizes operator interaction.
Data Sheets

Multi-Reflection Suppression (MRS) Technology

MRS technology suppresses any reflections that can distort the data, especially on shiny components, enabling precise 3D representation while the architecturally superior sensor design captures and transmits data simultaneously and in parallel. The result is unmatched speed and accuracy.

Post-test defect types and pre-shipping inspection capabilities

Post-test defect types and pre-shipping inspection capabilities
include: Components Edge,
Damaged PCB Corner, Goldfinger Discolored / Burnt / Badly Scratched, Gold Tab Inspection – Lifted Tie Bar, Burnt, Contamination,
Physically Damaged Components

Inspection Speed

50 cm2/sec (2D+3D)

Resolution

Sub 10 μm

Board Length
Board Width

Min. 25 mm / Max. 140 mm
Min. 17 mm / Max. 35 mm

Component Height Clearance (max)

35mm

Component Types Inspected

Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and more

Solder Joint Defects Categories

Solder bridge, opens, lifted leads, wettability, excess and insufficient solder, debris, and more

3D Measurement inspection

Lifted lead, package coplanarity, polarity dimple and chamfer identification

Other Items Detected

Gold-finger contamination, pin-in-hole, bent pins, debris, OCR/OCV and many others