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Speed your semiconductor processes with WaferSense and ReticleSense measurement devices.

When you need the most efficient and effective measurement devices for semiconductor tool set-up and maintenance processes, count on CyberOptics, the global market leader in wireless semiconductor measurement devices for chamber gapping, leveling, wafer-handoff teaching, vibration and airborne-particle measurement and relative humidity.

Semiconductor fabs and OEMs value the accuracy, precision and versatility of the WaferSense and ReticleSense measurement portfolio to enable improvements in fab yields and equipment uptime.

 

Save Time & Expense

  • Improve yields and increase tool uptime
  • Increase throughput
  • Reduce resource needs
  • Speed equipment set-up, maintenance cycles, trouble-shooting, qualification and release to production
  • Speed tool optimization, stabilization and standardization
  • Streamline fab processes
  • Establish repeatable and verifiable standards

Most Efficient and Effective

Since the wireless, Bluetooth® enabled and battery powered devices are wafer or reticle shaped, they can generally travel anywhere a wafer or reticle travels, providing optimal ease-of-use and access to locations that otherwise may be difficult or impossible to reach.

Vacuum Compatible

Calibrations can be done under closed-chamber process conditions with the vacuum compatible WaferSense and ReticleSense measurement devices.

Intuitive Software

Receive and record data in real-time on your laptop with CyberOptics easy-to-use software and count on accurate, precise, reliable and repeatable results that save time and expense compared to traditional or legacy methods.

Application:
Type:

WaferSense® Auto Vibration and Leveling Sensor

AVLS3
  • Speed equipment qualification with wireless measurements.
  • Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.
  • Lower equipment maintenance expenses and enhance process uniformity with objectiveand reproducible data.

WaferSense® Auto Multi Sensor™

AMS
  • Speed equipment qualification with wireless measurements.
  • Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.
  • Lower equipment maintenance expenses and enhance process uniformity with objectiveand reproducible data.

WaferSense® Auto Gapping System

AGS
  • Speeds non-contact gap measurements and parallelism adjustments under
    vacuum for semiconductor processes such as thin-film deposition, sputtering and etch.
  • Improves uniformity, tool availability and repeatability.
  • Includes GapView™ and GapReview™ software.

WaferSense® Auto Vibration System

AVS
  • Monitors 3-axis accelerations and vibration to enable yield improvements by maximizing acceleration and minimizing vibration.
  • Records vibration data for easy comparison between past and present, as well as one tool to another, to reduce particles, maintenance time and cycle time.
  • Includes VibeView™ and VibeReview™ software.

WaferSense® Auto Teaching System

ATS
  • “Sees” inside equipment to capture three dimensional offset data
    (x, y, and z) to quickly teach wafer transfer positions with accuracy to 100um.
  • Improves yields and lowers particulate contamination
    with accurate wafer hand-off calibration, proper alignment and set ups.
  • Includes TeachView™, TeachReview™ and TeachTarget™ software.

WaferSense® Airborne Particle Sensor™

APS1, 2 & 3
  • Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14um within semiconductor process equipment and automated material handling systems.
  • Easily identifies when and where the particles originate and measures the effectiveness of cleaning adjustments and repairs in real-time.
  • Includes ParticleSpectrum™ software.

WaferSense® Auto Leveling System 2 Vertical

ALS2V
  • Speeds setting the right inclination by measuring pitch, roll, rise overrun and vertical inclinations.
  • Quickly and accurately enables setting the same level across the tools for better process uniformity.
  • Includes LevelView™ and LevelReview™ software.

ReticleSense® Airborne Particle Sensor™

APSR / APSRQ
  • Quickly monitors, identifies and enables troubleshooting of airborne particles down to
    0.14um within semiconductor process equipment and
    automated material handling systems.
  • Easily identifies when and where the particles originate
    and measures the effectiveness of cleaning adjustments and repairs in real-time.
  • Includes ParticleSpectrum™ software.

ReticleSense® Auto Multi Sensor™

AMSR
  • Speed equipment qualification with wireless measurements.
  • Shorten equipment maintenance cycles with reticle-like form factor.
  • Lower equipment maintenance expenses and enhance process uniformity with objective and reproducible data.

CyberSpectrum™ Software

SOFTWARE FOR WAFERSENSE® AND RETICLESENSE®

CyberSpectrum is a powerful yet extremely simple software with an intuitive interface providing numerical and visual feedback for real-time measurement and analysis for multiple applications.

WaferSense® SDK

SOFTWARE DEVELOPMENT KIT

The WaferSense Software Development Kit provides the Application Programming Interface (API) to the WaferSense® and ReticleSense® family of devices. This allows direct integration of the device into user developed software applications.

NanoResolution MRS Sensor

Powered by MRS Technology

NanoResolution MRS Sensor for Wafer-Level and Advanced Packaging Applications for OEM integration.

SQ3000 CMM for Semiconductor Applications

The Ultimate in Speed and Accuracy for Coordinate Measurement Applications - Seconds. Not Hours

EX-Q Wafer Mapping Sensor

A DRAMATIC STEP FORWARD IN WAFER DETECTION

EX-QS Wafer Mapping Sensor

GOOD THINGS DO COME IN SMALL PACKAGES

Digital and Analog Frame Grabbers

DEPENDABLE, QUICK SETUP MACHINE VISION COMPONENTS