High-Precision 3D Sensing Technology Solutions for Inspection and Metrology

MRS Sensor for SQ3000 3D AOI, SPI and CMM CyberOptics’ breakthrough 3D sensing technology comprising four multi-view 3D sensors and a parallel projector delivering metrology grade accuracy at production speed. CyberOptics’ unique sensor architecture simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together. The result is ultra-high quality 3D images, accurate to sub 10 µm at production speed. Unmatched accuracy is achieved with the revolutionary MRS sensor technology by meticulously identifying and rejecting reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for accurate measurement making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.

Ultra-High Resolution MRS Sensor for SQ3000 3D AOI, SPI and CMM CyberOptics has advanced the proprietary Multi-Reflection Suppression (MRS) sensor to an even finer resolution with an accuracy of 7µm. The Ultra-High Resolution MRS sensor enhances the SQ3000 3D AOI platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications where an even greater degree of accuracy and inspection reliability is critical

MRS Sensor for SE3000 3D SPI The new SE3000 3D SPI system is the world’s first SPI system to incorporate the industry-leading Multiple-Reflection Suppression (MRS) technology with a finer resolution for the best accuracy, repeatability and reproducibility – Even on the smallest paste deposits. Combined with the award-winning, easy-to-use SPI software, solder paste inspection has reached a new level of precision for the most stringent requirements.

Ultra-High Resolution MRS Sensor for Semiconductor Applications MRS Technology is an ideal solution for a wide range of applications including socket metrology and micro-electronic applications.

NanoResolution MRS Sensor for Wafer-Level and Advanced Packaging Applications CyberOptics 3- micron NanoResolution MRS sensor enables metrology grade accuracy with superior 100% 2D and 3D inspection performance for features as small as 25-micron. 100% 2D and 3D inspection can be completed simultaneously at high speed, versus an alternate, slow method that requires two separate scans for 2D and 3D, and only a sampling of a few dies of the 25 wafers. It is two to three times faster than alternate solutions in the marketplace. With data processing speeds in excess of 75 million 3D points per second, the NanoResolution MRS sensor delivers throughput greater than 25 wafers (300mm) per hour. This best-in-class MRS sensor technology is ideally suited for the inspection of CPU sockets, IC package, solder balls and bumps, copper pillars, and other advanced packaging and mid-end semiconductor applications where high precision and high speed are needed.

MRS Sensor for Back-End Semi CyberOptics is an OEM supplier of proprietary MRS sensors to to KLA-Tencor (NASDAQ: KLAC) for KLATencor’s® BEOL package inspection systems.