CyberOptics today announced that it has been awarded a 2018 NPI Award in the category of Test and Inspection – SPI for its SE3000™ Solder Paste Inspection (SPI) system. The award was presented to the company during a Tuesday, Feb. 27, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
The new SE3000™ SPI system is the very first SPI system to incorporate the industry-leading Multi-Reflection Suppression (MRS) sensor technology with a finer resolution for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits and 0201 metric components.
Combined with the award-winning, easy-to-use software, solder paste inspection has reached a new level of precision for the most stringent requirements.
“We are very honored to receive the sixth award related to our proprietary MRS sensor technology, now integrated into our SE3000 SPI system,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “MRS technology has been delivering unprecedented inspection results that drives yield improvements for our customers with the most challenging requirements – for 3D AOI, metrology, semiconductor and now 3D SPI.”
SE3000™ fully supports feedback and feed forward capability with leading Solder Paste Printer and SMT Mounter vendors respectively. SE3000-DD Dual lane, Dual sensor and SE3000-X for large board capability also are available. With simple conﬁguration settings, SE3000™ gives you the power to do more with SPI results – optimize printing process, establish stencil cleaning cycles and ﬁne-tune printer setup. All of this means reduced rework costs, increased production throughput and improved yields.