CyberOptics NanoResolution MRS Sensor Wins 2019 Best of West Award at SEMICON West
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, announced that SEMI, the global industry association representing the electronics manufacturing and design supply chain, and Semiconductor Digest yesterday presented the 2019 Best of West award to CyberOptics for the new NanoResolution MRS Sensor. The award recognizes important product and technology developments in the electronics manufacturing supply chain.
For mid-end and advanced packaging inspection and measurement, CyberOptics new proprietary NanoResolution Multi-Reflection Suppression (MRS) sensor technology meticulously identifies and rejects multiple reflections caused by shiny components and mirror-like surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements.
“There’s a big emphasis on metrology at this year’s SEMICON West,” said Pete Singer, editor in chief of Semiconductor Digest. “The CyberOptics MRS Sensor is a great example of a fantastic new tool now available to semiconductor manufacturers.”
The 3-micron NanoResolution MRS sensor (X/Y resolution of 3 micron, Z resolution of 50 nanometer) enables metrology grade accuracy with superior 100% 2D and 3D inspection performance for features as small as 25-micron. Further, it is two to three times faster than alternate solutions in the marketplace. With data processing speeds in excess of 75 million 3D points per second, it delivers throughput greater than 25 wafers (300mm) per hour. 100% 2D and 3D inspection can be completed simultaneously at high speed, versus an alternate, slow method that requires two separate scans for 2D and 3D, and only a sampling of a few dies of the 25 wafers.
“We are honored to win the 2019 Best of West award for the NanoResolution MRS sensor,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “I am very proud of our R&D and technical team that advanced our MRS sensor capabilities to address the mid-end and advanced packaging market.”
Offering an unparalleled combination of high accuracy, high resolution and speed, best-in-class MRS sensor technology is widely used for inspection and measurement in the SMT, semiconductor and metrology markets. The new NanoResolution MRS sensor is ideally suited for the inspection of CPU sockets, IC package, solder balls and bumps, copper pillars, and other advanced packaging and mid-end semiconductor applications where high precision and speed are needed.