CyberOptics Demonstrates High-Precision Sensing Solutions to Improve Yield and Throughput at SEMICON West
Minneapolis, Minnesota — November 24, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will feature the In-Line Particle Sensor™ (IPS™), and demonstrate WaferSense® and ReticleSense® sensors for semiconductor tool set-up and diagnostics at SEMICON West in San Francisco, California, from December 7-9th in booth 1639. The company will also demonstrate the NanoResolution Multi-Reflection Suppression™ (MRS™) sensor that is integrated into the WX3000™ Metrology and Inspection system for wafer-level and advanced packaging.
CyberOptics’ IPS with CyberSpectrum™ software detects particles in gas and vacuum lines 24/7 in semiconductor process equipment and other controlled environments. It is particularly relevant for EUVL tools where the ability to monitor particles in-line can significantly improve tool yield and productivity. The IPS is an extension of the industry-leading WaferSense and ReticleSense Airborne Particle Sensor™ (APS™/APSRQ™) technology that is documented by fabs as the Best-Known Method (BKM). IPS quickly identifies, monitors and enables troubleshooting of particles down to 0.1µm. The effects of cleaning, adjustments and repairs can be seen in real-time. Equipment and process engineers can speed equipment qualification, shorten equipment maintenance cycles and lower equipment maintenance expenses.
“We continue to deploy our proprietary high-precision sensing technologies across various areas of fabs worldwide,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, “Whether it’s for semiconductor tool set-up and diagnostics, or inspection and metrology, we’re focused on enabling our customers to recognize significant improvements in yields, processes, productivity and throughput.”
The company also will feature the 3 µm NanoResolution MRS sensor that provides sub-micrometer accuracy on features as small as 25µm. The sensor is integrated into the WX3000 Metrology and Inspection system designed for wafer-level and advanced packaging applications. While retaining its ability to reject spurious multiple reflections, it adds the ability to capture and analyze specular reflections from shiny surfaces of solder balls, bumps and pillars, allowing highly accurate inspection and metrology of these critical packaging features. Fast, 100% 3D/2D inspection and metrology can be conducted with throughput greater than 25 wafers (300mm) per hour, 2-3X faster than alternative solutions.