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WX3000™ Metrology and Inspection Systems for Wafer-Level and Advanced Packaging

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WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression® (MRS®) Sensor Technology.

Metrology-Grade Accuracy with MRS® Technology

Sub-micrometer accuracy for features as small as 25 μm. Accurately inspect shiny or mirror-like surfaces. Attain repeatable and reproducible measurements.

Fast, Superior Inspection Performance

Increase throughput with the MRS sensor that is 2-3X faster than alternate technologies, delivering greater than 25 wafers (300mm) per hour for 12" and 8" wafer sizes and 55 wafers per hour (200mm) for 6" and 8" wafer sizes. Attain 3D and 2D measurements in one pass versus multiple separate scans. Conduct 100% 3D and 2D metrology and inspection versus sampling-only methods.

Versatility for Wafer-Level and Advanced Packaging Applications

Measure and inspect a wide range of semiconductor applications including gold bumps, solder balls and bumps, wafer bumps, copper pillars and other wafer-level and advanced packaging applications. Measure and inspect critical packaging features including bump height, coplanarity, diameter and shape, relative location and variety of other measurements.
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Powered by Multi-Reflection Suppression® (MRS®) Sensor Technology

The 3-micron NanoResolution (X/Y resolution of 3
micron, Z resolution of 50 nanometer) MRS sensor
enables metrology grade accuracy with superior 100% 3D and 2D measurement performance for features as small as 25-micron.

Increase Throughput

100% 3D and 2D metrology and
inspection can be completed simultaneously at high
speed, versus an alternate, slow method that requires
two separate scans for 2D and 3D, and only a sampling
of a few die.

Delivering greater than 25 wafers (300mm) per hour for 12″ and 8″ wafer sizes and 55 wafers per hour (200mm) for 6″ and 8″ wafer sizes.

3D Capability

Full Wafer

3D Accuracy

0.2μm (VLSI standard)

3D Repeatability

0.3 µm @ 3σ (VLSI standard)

Bump Height (Size) Coverage Range

25-250 μm

3D + 2D Throughput (300mm full wafer)

≥ 25 WPH

3D + 2D Throughput (200mm full wafer)

≥ 55 WPH

2D Objectives and Resolution

Fixed resolution – 3μm

2D Measurement Accuracy for Bump & RDL

1/2 (1.5μm) pixel size accuracy

2D Measurement Repeatability

1.6μm @ 3σ

2D Measurement Range

>20μm

See brochures for additional specifications