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The Ultimate in Speed and Accuracy

SQ3000™ / SQ3000-X™ 3D AOI

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SQ3000 3D Automated Optical Inspection (AOI) system maximizes ROI and line utilization with 3D multi-view sensors that enable fastest 3D inspection in the industry. SQ3000 incorporates Multi-Reflection Suppression® technology (MRS®) and highly sophisticated 3D algorithms offering microscopic image quality at production speeds. SQ3000-X offers expanded capabilities supporting large boards up to 710 x 610 mm, inspecting the most demanding assemblies without compromising measurement accuracy and repeatability.

Metrology Grade Accuracy

Attain highly accurate data with the industry-leading Multi-Reflection Suppression® (MRS®) sensor technology that meticulously identifies and rejects reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurement, making MRS an ideal technology for a wide range of applications including those with very high quality requirements.

High Speed Inspection

Speed inspection with the MRS sensor that simultaneously captures and transmits multiple images in parallel, while highly sophisticated fusing algorithms merge the images together, delivering microscopic image quality at production speed.

Fast, Smart, Easy-to-use software

Reduce training efforts and minimize operator interaction with the AOI software’s intuitive interface, multi-touch controls and 3D image visualization tools take ease of use to a whole new level.

Speed programming with AI2 (Autonomous Image Interpretation) to keep it simple – no parameters to adjust or algorithms to tune.

Attain full-fledged machine-level to factory-level SPC capability with powerful historical analysis and reporting tools included in CyberReport™. Improve traceability for process verification and yield improvement.
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Case Studies and White Papers

MRS® (Multi-Reflection Suppression®) Sensor Technology

MRS technology suppresses any reflections that can distort the data, especially on shiny components, enabling precise 3D representation while the architecturally superior sensor design captures and transmits data simultaneously and in parallel. The result is unmatched speed and accuracy.

36+

Award-Winning MRS Technology

Ultimate

High Accuracy, Resolution and Speed

Intuitive

Easy-to-Use Software

Inspection Speed

Standard MRS Sensor: 40 cm²/sec (2D+3D)

High-Speed MRS Sensor: 50 cm²/sec (2D+3D)

High-Resolution MRS Sensor: 20 cm²/sec (2D+3D)

Ultra-High Resolution MRS Sensor: 15 cm²/sec (2D+3D)

Field of View (FOV)

Standard MRS Sensor: 36 x 30 mm

High-Speed MRS Sensor: 36 x 36 mm

High-Resolution MRS Sensor: 26 x 26 mm

Ultra-High Resolution MRS Sensor: 21 x 21 mm

Board Size

SQ3000: Min. 50 x 50 mm, Max. 510 x 510 mm

SQ3000-X: Min. 50 x 120 mm, Max. 710 x 610 mm

Resolution

Standard MRS Sensor and High-Speed MRS Sensor: Sub 10µm

High-Resolution MRS Sensor and Ultra-High Resolution MRS Sensor: 7µm

Component Height Clearance

Top: 50mm, Bottom: 30mm

Component Types Inspected

Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and more

Component Defects

Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more

Solder Joint and Other Defects

Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins