SQ3000+ Multi-Function System with Multi-Reflection Suppression® (MRS®) sensor technology provides the ultimate combination of high resolution, high accuracy and high speed for inspection and metrology. It remains the only system on the market capable of performing AOI, SPI and CMM in-line.
Ultra-High Resolution, 5 Micron - Multi-Reflection Suppression (MRS) Technology
Inspection and Metrology Solution for Assembly and Process Improvement for Advanced Applications
Intuitive, Easy-to-Use Software - Enable Smarter, Faster Inspection
Faster, Highly Accurate Coordinate Measurement (CMM) Suite
The new, ultra-high resolution 5 micron MRS sensor incorporated into the SQ3000+ is specifically designed for advanced applications with the most demanding requirements.
The SQ3000+ with MRS technology is ideal for high-end applications including advanced packaging, mini/micro LED, advanced SMT applications for automotive, medical, military, aerospace and advanced electronics, 008004/0201 solder paste inspection (SPI), socket metrology and other high-end coordinate measurement (CMM) applications where quality and reliability are critical.
Award-Winning MRS Technology
High Accuracy, Resolution and Speed
Easy-to-Use Software
Inspection Speed
16 cm²/sec (2D+3D)
Minimum Component Size
0201 mm (008004 in.)
PCB Size
Minimum: 50 x 50 mm (2 x 2 in.);
Maximum: 420 x 320 mm (16.5 x 12.5 in.)
Component Height Clearance
Top: 20 mm ; Bottom: 50 mm
Resolution XY / Z
5 µm / 0.1 µm
Field of View (FOV)
25 x 25 mm
Maximum Weight (PCB or Sample)
10 kg
Min./ Max. Feature Height:
Min. 10 µm ; Max. 400 µm at spec, 2.4 mm capability
Component Types Inspected
Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and more
Component Defects
Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more
Solder Joint and Other Defects
Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins
Coordinate Measurement
Capability
Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Offset,
X,Y Offset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius, Coplanarity/ Distance to plane / 2nd Order fitting, Difference / Absolute / 2sqrt / VC, Max / Min / Ave / Sigma / Plus / Minus / Multiple
See brochure for additional information.