SQ3000™ for SPI

Ultimate in Speed and Accuracy

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Metrology-Grade Accuracy

Attain highly accurate data with the industry-leading Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurement, making MRS an ideal technology for a wide range of applications including those with very high quality requirements.

High Speed Inspection

Speed inspection with the MRS sensor that simultaneously captures and transmits multiple images in parallel, while highly sophisticated fusing algorithms merge the images together, delivering microscopic image quality at production speed.

Fast, Smart, Easy-to-use software

Reduce training efforts and minimize operator interaction saving time and cost with the powerful yet simple software with intuitive multi-touch interface and 3D visualization tools.

Reduce rework costs, increase throughput, improve quality with feedback, and feed forward capable SPI Systems with leading Solder Paste printer and SMT Mounter vendors.

Improve yields and reduce downtime with the CyberPrint Optimizer™ predictive process improvement capability that automatically optimizes the print process by proactively analyzing current trend data.

Improve yields with full-fledged machine-level to factory-level SPC capability.

MRS Technology for 3D SPI

CyberOptics’ unique sensor architecture with 4 multi-view 3D sensors and a parallel projector, simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together, delivering metrology grade accuracy at production speed.


Award-Winning MRS Technology


High Accuracy, Resolution and Speed


Easy-to-Use Software

Inspection Speed

MRS Sensor:
Inspection Speed 40 cm2/sec (2D+3D), High Speed option
available: 50 cm2/sec (2D+3D)

Ultra High-Resolution MRS Sensor:
15 cm2/sec (2D+3D)

Minimum Component Size

0402 mm (01005 in.)

0201 mm (008004 in.)

PCB Size

SQ3000: Minimum: 50 x 50 mm (2 x 2 in.); Maximum: 510 x 510 mm (20 x 20 in.)

SQ3000-X: Minimum: 50 x 120 mm (2 x 4.7 in.); Maximum: 720 x 620 mm (28.3 x 24.4 in.)

Component Height Clearance

Top: 50 mm ; Bottom: 30mm

Component Types Inspected

Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and more

Component Defects

Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more

Solder Joint and Other Defects

Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins

3D Measurement Inspection

Lifted Lead, package coplanarity, polarity dimple and chamfer identification

Solder Paste Inspection

Height, area, volume, registration and bridge detection


MRS Sensor:
Sub 10 μm

Ultra High-Resolution MRS Sensor:
7 μm