SQ3000
SQ3000™ for SPI
Ultimate in Speed and Accuracy
Metrology-Grade Accuracy
High Speed Inspection
Fast, Smart, Easy-to-use software
CyberOptics’ unique sensor architecture with 4 multi-view 3D sensors and a parallel projector, simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together, delivering metrology grade accuracy at production speed.
Award-Winning MRS Technology
High Accuracy, Resolution and Speed
Easy-to-Use Software
Inspection Speed
Standard MRS Sensor: 40 cm²/sec (2D+3D)
High-Speed MRS Sensor: 50 cm²/sec (2D+3D)
High-Resolution MRS Sensor: 20 cm²/sec (2D+3D)
Ultra-High Resolution MRS Sensor: 15 cm²/sec (2D+3D)
Minimum Component Size
Standard MRS Sensor and High-Speed MRS Sensor
0402 mm (01005 in.)
High-Resolution MRS Sensor and Ultra-High Resolution MRS Sensor
0201 mm (008004 in.)
Board Size
SQ3000: Min. 50 x 50 mm, Max. 510 x 510 mm
SQ3000-X: Min. 50 x 120 mm, Max. 710 x 610 mm
Resolution
Standard MRS Sensor and High-Speed MRS Sensor: Sub 10µm
High-Resolution MRS Sensor and Ultra-High Resolution MRS Sensor: 7µm
Component Height Clearance
Top: 50 mm ; Bottom: 30mm
Component Types Inspected
Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and more
Component Defects
Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more
Solder Joint and Other Defects
Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins
3D Measurement Inspection
Lifted Lead, package coplanarity, polarity dimple and chamfer identification
Solder Paste Inspection
Height, area, volume, registration and bridge detection