CyberOptics

Solder Paste Inspection /
SE 300™ Ultra

SE300 Ultra

System Features

      • Industry-leading 100% 3D solder paste inspection
      • Paste height, area, and volume measurements with Gage R&R < 10%
      • Technology-leading 01005 pad inspection capabilities
      • Enhanced warp compensation for flexible circuits with cutouts
      • Ability to handle odd-shaped pads
      • Conveyor auto-width adjustment capability
      • Program call-up using bar code reader
      • XML file format output for easy integration to shop floor control systems
      • Connects to Process Insight™ SPC software for data analysis

          New for 2007

            • Inspection speed improvements—up to 30% improvement
            • Programming time improvement—less than 15 minutes with ODB++ file import
            • 1D/2D multiple bar code read with sensor
            • Mechanical board stop solution
            • NG stacker/offline defect review

            Downloadable Information

            Data Sheets


            Articles and Information


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