CyberOptics

NEW PRODUCT!

Solder Paste Inspection / SE500cp™
Best Performance for Best Value!

SE500cp

The SE500cp is capable of inspecting the most demanding assemblies with 80 cm2/second inspection speed.  Not just simpler and fast, SE500cp also offers uncompromised measurement accuracy and repeatability even at such high speeds.

Key Features and Benefits

• Fastest 3-D SPI-- >80cm2/second inspection speed that doesn’t compromise measurement accuracy and repeatability.

• SE500cp can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing lines speeds.

• Best value—Simple robust design with calibration-free sensor technology offers the lowest cost of ownership in the industry.


Downloadable Information

Data Sheets




Products Solder Paste Inspection SE350 SE500 SE500cp SE 300 Ultra SE500-D Automated Optical Inspect Flex HR QX500 Statistical Process Control Process Insight Process Monitor OEM Sensors WaferSense Wafer Mapping Sensors Frame Grabbers -- -- -- Home
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