From the company that defined 3-D solder paste measurement comes the next era of solder paste inspection.  With the largest installed base of 3-D solder paste inspection systems, CyberOptics’ experience and our field-proven capability in SPI since 1990 support our strong reputation for high-value inspection systems.

• Fastest 3-D SPI-- >80cm2/second inspection speed that doesn’t compromise measurement accuracy and repeatability.

• Most accurate SPI—SE500 can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing lines speeds.

• Superior 3D Measurement Capability - SE500 provides 3D height, volume and area measurements for PCBs with CSPs, micro-BGAs, 0201s, 01005s and other small pad sizes. SE500 is equipped with flexible circuit warp compensation algorithm to compensate for warp on complex shapes