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A LEAP FORWARD IN SOLDER PASTE INSPECTION

SE3000™/ SE3000-X™ 3D SPI

Maximize yields with the World’s First SPI system incorporating the MRS® Sensor technology. When only the very best will do.

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SE3000-X and SE3000-XL also available for large board capability. SE3000-DD Dual Lane, Dual Sensor system option also available.
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Metrology Grade Accuracy

Attain highly accurate data with the industry-leading Multi-Reflection Suppression® (MRS®) sensor technology that meticulously identifies and rejects reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for highly accurate measurement, making MRS an ideal technology for a wide range of applications including those with very high quality requirements.

High Speed Inspection + High Resolution Inspection

Speed inspection with the MRS® sensor that simultaneously captures and transmits multiple images in parallel, while highly sophisticated fusing algorithms merge the images together, delivering microscopic image quality at production speed. The new Dual-Mode MRS sensor for the SE3000™ SPI system provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high speed inspection and another mode for high resolution inspection.

Fast, Smart, Easy-to-use software

Reduce training efforts and minimize operator interaction saving time and cost with the powerful yet simple software with intuitive multi-touch interface and 3D visualization tools.

Reduce rework costs, increase throughput, improve quality with feedback, and feed forward capable SPI Systems with leading Solder Paste printer and SMT Mounter vendors.

Improve yields and reduce downtime with the CyberPrint Optimizer™ predictive process improvement capability that automatically optimizes the print process by proactively analyzing current trend data.

Improve yields with full-fledged machine-level to factory-level SPC capability.
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Case Studies and White Papers

Dual-Mode MRS® Sensor with High Speed and High Resolution Modes

The SE3000 SPI System brings the revolutionary MRS® technology to solder paste inspection delivering higher performance in accuracy and precision. Effective suppression of multiple reflections is critical, making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.

MRS® Technology for 3D SPI

CyberOptics’ unique sensor architecture with 4 multi-view 3D sensors and a parallel projector, simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together, delivering metrology grade accuracy at production speed.

The new Dual-Mode MRS® sensor for the SE3000™ SPI system provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high speed inspection and another mode for high resolution inspection.

Award-Winning Intuitive Software

The SPI V5 series software delivers world-class user experience with its intuitive interface, completely changing the way users interact with our system. Yet, at the same time, the software is extremely stable and simple to use enabling shortest learning curve.

36+

Award-Winning MRS Technology

Ultimate

High Accuracy, Resolution and Speed

Intuitive

Easy-to-Use Software

Inspection Speed

MRS Sensor:

Peak: 35cm²/sec (2D + 3D)

Average: 30 cm²/sec (2D+3D)

Ultra High-Resolution MRS Sensor:

Peak: 15cm²/sec (2D + 3D)

Average: 12 cm²/sec (2D+3D)

Resolution

MRS Sensor:

18µm

Ultra High-Resolution MRS Sensor:

9µm

Board Size

SE3000: Min. 50 x 50 mm, Max. 510 x 510 mm
SE3000-X: Min. 50 x 120 mm, Max. 710 x 610 mm
SE3000-XL: Min. 50 x 120 mm, Max. 1200 x 610 mm with 2 index inspection capability

Clearance

Top (above belt): 30mm, Bottom: 35mm