SE3000-DD™ & SE3000-D™

SE3000 DD SPI system offers unmatched accuracy with the revolutionary MRS® technology by meticulously identifying and rejecting reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical, making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.

CyberOptics has advanced the proprietary Multi-Reflection Suppression (MRS) sensor to an even finer resolution. The Ultra-High Resolution MRS sensor enhances the SE3000 DD platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications where an even greater degree of accuracy and inspection reliability is critical.

The SE3000 DD 3D Solder Paste Inspection (SPI) System is an extension of the award-winning SE3000™ 3D SPI platform. The dual lane, dual sensor system maximizes flexibility catering to varying PCB widths. This unique design provides the ability to inspect high volume assemblies, the convenience of inspecting different assemblies and board sizes simultaneously on different lanes, or even switching from dual lane to single lane mode to inspect very large boards.

Not only does the SE3000 DD provide PCB flexibility, it also provides the flexibility to choose two of the same or two different proprietary MRS sensors.

The SPI V5 series software delivers world-class user experience with its intuitive interface, completely changing the way users interact with our system. With full multi-touch experience, SPI V5 series software offers a range of revolutionary features that enable smarter and faster inspection.