The MX3000™ is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS® Sensors delivering simultaneous dual-sided automated final vision inspection for singulated memory modules – for metrology grade accuracy at production speed.
The system provides in-line defect review stations and auto sorts false calls into good trays after review, is fully automation-ready, SECS/GEM and S2/S8 compliant.
Multi-Reflection Suppression® (MRS®) Technology
Flexibility At Its Best
Faster, Smarter Programming
MRS technology suppresses any reflections that can distort the data, especially on shiny components, enabling precise 3D representation while the architecturally superior sensor design captures and transmits data simultaneously and in parallel. The result is unmatched speed and accuracy.
Post-test defect types and pre-shipping inspection capabilities
include: Components Edge,
Damaged PCB Corner, Goldfinger Discolored / Burnt / Badly Scratched, Gold Tab Inspection – Lifted Tie Bar, Burnt, Contamination,
Physically Damaged Components
50 cm2/sec (2D+3D)
Sub 10 μm
Min. 25 mm / Max. 140 mm
Min. 17 mm / Max. 35 mm
Component Height Clearance (max)
Component Types Inspected
Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and more
Solder Joint Defects Categories
Solder bridge, opens, lifted leads, wettability, excess and insufficient solder, debris, and more
3D Measurement inspection
Lifted lead, package coplanarity, polarity dimple and chamfer identification
Other Items Detected
Gold-finger contamination, pin-in-hole, bent pins, debris, OCR/OCV and many others