EX-Q Wafer Mapping Sensor

Features

• EX-QS is available in two standoff distances: 1.5″ and 2.2″. EX-Q is available in 1.5” and 2.2”
• Detects bright, dark and coated wafers in various size and edge geometries at factory gain setting.
• Insensitive to interference from the mapping environment including stray reflections.
• Easy-to-use, “off-the-shelf” direct interface requires no amplification or signal conditioning and reduces tool total cost of ownership.

• Non-intrusive wafer mapping solution protects valuable wafers from inadvertent crashes.
• No moving parts that can result in particulate contamination.
• Detects cross-slotted and ultra-thin wafers.
• Note: Connector is an option and must be specified when ordered.