Extending 3D MRS Sensor Technology to Address Challenging Measurement and Inspection Applications

There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets.

3D Multiple Reflection Suppression (MRS) sensor technology has been effectively combined with Automated Optical Inspection for several years and is now being utilized for many SPI applications such as microelectronics and sub-100-micron solder paste deposits and other challenging applications, like packaging, automotive, medical and other applications with stringent quality requirements. In addition to inspection, there is an increasing need to capture coordinate measurements inline.