Press Releases

CyberOptics Integrates Advanced MRS Technology into New SE3000™ 3D Solder Paste Inspection System

CyberOptics will demonstrate the new SE3000™ 3D Solder Paste Inspection (SPI) system with a proprietary Multiple-Reflection Suppression (MRS) Sensor in Hall A2, Stand 439 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München, in Germany.