CyberOptics Demonstrates Yield-Improving Auto Vibration and Leveling Sensor at SEMICON Europa

Minneapolis, Minnesota — October, 2019 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Europa from November 12-15, 2019 at the Messe Munchen in booth #B1101. During the show, the company will demonstrate its new WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3) with CyberSpectrum™ software for semiconductor tool set-up and diagnostics.

At only 3.5mm, AVLS3 can travel with ease to most fab locations where a wafer travels. The Chemically Hardened Glass (CHG) substrate enables smooth wafer handling and improved vacuum chucking.

With long-range wireless capability, AVLS3 combined with new, easy-to-use CyberSpectrum software, collects and displays both leveling and vibration data simultaneously for fast equipment set-up, alignment and real-time equipment diagnostics.

AVLS3 can speed equipment qualification, shorten equipment maintenance cycles and lower equipment maintenance expenses. Semiconductor engineers can also enhance process uniformity with the objective and reproducible data.

CyberOptics will also demonstrate the WaferSense Airborne Particle Sensor (APS3) that is recognized by semiconductor fabs as the Best Known Method (BKM) for wirelessly detecting and monitoring airborne particles in real-time.

Semiconductor fabs and equipment OEMs worldwide have adopted WaferSense devices to significantly improve yields and increase tool uptime.