2007 – CyberOptics introduces the Flex High-Resolution AOI system for 01005 component inspection.

2006 – CyberOptics introduces The MicroPad™ sensor for SE 300 to provide accurate 3D solder paste measurements for 01005 component pads.

2005 – CyberOptics launches its first embedded process verification product - EPV  5.

2003 – CyberOptics introduces custom camera technology for fiducial alignment inside robotic SMT assembly equipment.

2001 – CyberOptics acquires Imagenation®, adding a line of industry leading frame-grabbers to the product line.

2000 – CyberOptics introduces the SE300™ – the world leading in-line 100% 3D solder paste inspection system.

1999 – CyberOptics acquires Kestra, Ltd. adding the innovative SAM™-based Automated Optical Inspection system to the product line.

1996 – First in-line non-contact 3D solder paste inspection system introduced.

1994 – CyberOptics introduces LaserAlign, the first non-contact, on-head component alignment sensor for pick-and-place machines.

1990 – First non-contact, laser-based 3D solder paste inspection system introduced.

1987 – NASDAQ® listed under CYBE.

1984 – CyberOptics founded by Dr. Steven K. Case, University of Minnesota professor.

• 1st laser based, non-contact profiling system (CyberScan®).
  


• 1st laser-based, non-contact solder paste inspection system (LSM™).
  
  
• 1st high-speed, non-contact centering method for component placement systems (LaserAlign®).
  
  
• 1st digital, PC-based high-resolution "smart sensors" for non-contact 3D measurement with sub-micron precision (DRS™).
  
  
• 1st embedded inspection sensor for electronic component placement analysis (EPV®).