Advanced Packaging and Wafer Level Inspection & Metrology
Multi-Reflection Suppression™ Technology
System and Sensor Solutions
CyberOptics inspection and metrology systems and sensors provide the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression™ (MRS™) Sensor Technology.
Increase throughput that is 2-3X faster than alternate technologies, attain 3D and 2D measurements in one pass versus multiple separate scans, and conduct 100% 3D and 2D metrology and inspection versus sampling-only methods.
WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression™ (MRS) Sensor Technology.
Offering an unparalleled combination of high accuracy, high resolution and speed, MRS sensors are widely used for inspection and measurement in the SMT and semiconductor markets. The 3-micron NanoResolution (X/Y resolution of 3 micron, Z resolution of 50 nanometer) MRS sensor enables metrology grade accuracy with superior 100% 3D and 2D measurement performance for features as small as 25-micron.
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